Inha University recently signed a Memorandum of Understanding (MOU) with FuriosaAI, a leading domestic AI semiconductor company, to promote collaboration in AI semiconductor design and human resource development.
Under this agreement, the two parties will conduct joint research and technology exchange across the entire AI semiconductor process, including design, packaging, and testing.
They also aim to cultivate practically skilled semiconductor professionals by integrating advanced industrial technologies into education and research.
Specifically, the partnership will pursue: •Joint development and research in AI semiconductor design, verification, packaging, and testing •Development of practice-oriented educational programs based on industrial needs •Student internships and joint industry–academia projects •Cooperative training in design, verification, packaging, and testing technologies
Through this partnership, the Semiconductor Specialized Graduate Program plans to strengthen a sustainable industry–academia collaboration model that links education, research, and industry.
FuriosaAI is a company developing high-performance, low-power AI inference accelerators (NPUs) that enhance the computational efficiency of large-scale AI models. The company recently attracted global attention with the release of its “RNGD (Renegade)” AI accelerator.
Additionally, FuriosaAI contributes to strengthening Korea’s AI semiconductor competitiveness through chip development using TSMC’s 5nm process and the advancement of AI computation technologies for data centers.
Jun-Ho Baek, CEO of FuriosaAI, stated, “Inha University, with its outstanding educational infrastructure and research environment, is the ideal partner to cultivate the core talent needed in the AI semiconductor industry. Through close collaboration, we will foster integrated technical experts covering design, packaging, and testing, and contribute to enhancing Korea’s national semiconductor competitiveness.”
President Myung-Woo Cho added, “This agreement will serve as a model case of close cooperation between academia and industry in key processes of the AI semiconductor sector—design, packaging, and testing. We will build an educational foundation that allows students to experience real chip development processes and acquire the practical skills demanded in the field.”
